Bostik further extends Born2Bond™ range for electronics manufacturing

08 November 2021

Bostik, an Arkema Company, has extended its Born2Bond engineering adhesive range designed to support the electronics manufacturing sector in the assembling, waterproofing, dustproofing and serviceability of miniaturised electronics, such as wearables and handheld devices and larger applications such as smart meters and LED lights.

An article on this technology is available in the November issue of Asia Pacific Coatings Journal.

Born2BondTM MECA-based cyanoacrylates and innovative dual-cure Light Lock adhesives (patented in multiple countries) are already available for electronics OEMs for high-precision instant bonding, encapsulation and potting applications. Coupled with automatic dispensing solutions they provide high performing and convenient options for designers and engineers.

The new versatile and single-component High Performance HMPUR (Hotmelt Polyurethane Reactive) range has been designed specifically for the manufacture of miniaturised handheld and wearable electronic devices such as mobile phones, smart watches and headphones. High Performance HMPUR products are available with a range of viscosities and open times to suit different applications and assembly processes.

Ideal for handheld devices and wearable technology, Born2BondTM High Performance HMPUR adhesives deliver excellent bonding performance (both rigid and elastic) and are capable of withstanding fluctuations in temperature and humidity, as well as being resistant to impact and chemical or organic compounds such as sweat or sebum.

Born2BondTM new UV-CIPG (UV Cure-in-place Gasket) range provides single-component, precise gasketing solutions with typically 0.5-2mm high gaskets for waterproofing, dustproofing and serviceability of mobile phones, tablets, smart watches, digital cameras, and automotive applications such as battery management systems (BMS), electronic control units (ECU) and advanced driver-assistance systems (ADAS). The adhesives offer excellent adhesion to a variety of substrates including plastic, glass and metal – and provide an effective and cost-efficient solution to cut or molded gaskets that are typically assembled by hand with significant labour costs and carry a high risk of defect. They also eliminate the need for investment in expensive and space-consuming equipment such as molds and ovens.

The UV-CIPG range delivers an extremely flexible and robust result that does not crack even when compressed or deformed, and which can withstand exposure to temperature fluctuations and chemicals. With high thixotropic indexes, the products provide a consistent bead aspect ratio and can be rapidly and precisely dispensed using automatic dispensing equipment.

For larger applications such as smart meters and LED lights where 2-5mm-high gaskets are required for dust and water proofing, Bostik’s UV-FG (UV Foam Gasket) range provides a fast-curing alternative to molded gaskets that can easily be integrated into manufacturing lines. Its single-component design means mixing is not required and a high-foam expansion enhances resilience during the assembly process.

Polivio Goncalves, Bostik’s Global Head for Engineering Adhesives, says the range delivers the exacting aesthetics and high performance required for miniaturised electronics engineering: "Wearable tech is a growing market and the requirement for ever-more-durable waterproof and dustproof electronics is increasing. These ranges have been designed to support engineers as the market continues to develop.”

As part of Arkema Group, Bostik’s offering is extended with High Performance Polymers such as the bio renewable Rilsan® PA11, Pebax® Elastomers, and Kynar® PVDF for battery and electronics designer and manufacturers.

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