More news
Advances in Electronics Packaging: Conductive Adhesives and Thermal Interface Materials
By Rachel Gordon, Technology Analyst, IDTechEx
Space is limited – reserve your seat today!
There are increasing concerns with the use of tin-lead alloy solders because of health hazards of using lead. New research now aims to determine which materials should be used to replace the estimated 50,000 metric tons of tin-lead solder currently used each year.
However, no material can replace tin-lead metal solders in all applications. Depending on the application in question, and whether the solder was used primarily for electrical or thermal conduction, a variety of polymeric thermal interface materials (TIM) or electrically conductive adhesives (ECA) may be suitable.
This webinar will discuss the wide range of TIM and ECAs that are commercially available, explaining their chemistry and physical properties. This will be correlated to the advantages and applications of each, explaining the large market share or growing popularity of certain materials.
The webinar will also investigate where the semi-conductor packaging market is headed next, including discussions of nano-fillers, finer feature sizes and a wider variety of possible substrates.
We will be holding exactly the same webinar twice in one day. Please register for which ever session is most convenient for you.
Date: Thursday 11 February 2016
Duration: 30 minutes plus 10 minutes for Q&A
Webinar #1: Europe & Asia-Pacific
9:30am (GMT) London
10:30am (GMT+1) Amsterdam, Berlin, Rome
11:30am (GMT+2) Athens, Jerusalem, Moscow
4:30pm (GMT+7) Bangkok
5:30pm (GMT+8) Singapore, Taipei, Beijing
6:30pm (GMT+9) Tokyo, Seoul
8:30pm (GMT+11) Canberra
Register for #1 now: https://attendee.gotowebinar.com/register/7500855502394331650
Webinar #2: Americas
9:00am (Pacific ST) USA & Canada
10:00am (Mountain ST) USA & Canada
11:00am (Central ST) USA & Canada
12:00noon (Eastern ST) USA & Canada
5:00pm (GMT) London
Register for #2 now: https://attendee.gotowebinar.com/register/62303098722398722
Contact
[email protected]
UK: +44 (0)1223 812300
US: +1 617 577 7890
