- New British Coatings Federation report highlights essential coatings contribution to econo...
- PPG announces leadership changes in aerospace coatings business
- Vattenfall and BASF to partner on German offshore wind farms Nordlicht 1 and 2
- AkzoNobel Powder Coatings partners with coatingAI to explore new frontiers in sustainabili...
- PPG again earns Equality 100 Award in 2023 Corporate Equality Index, spotlighting 20 years...
For demanding applications where flexible, impact resistant bonds are required, Master Bond has developed Polymer System EP37-3FLF. This optically clear, two component epoxy has resistance to cryogenic temperatures and severe thermal cycling. The company says its low exotherm also makes it a superb potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. Its unique combination of properties allows it to cure without stressing delicate electronic components.
Serviceable over a range of 4K to 250°F, EP37-3FLF cures at room temperature in two to three days or faster at elevated temperatures. This epoxy offers a convenient, non-critical 1:1 mix ratio by weight or volume, and a low mixed viscosity of 1,400 to 1,500 cps. Additionally, users can work with a 100g mass of the adhesive at room temperature for up to 90min.
EP37-3FLF has a bond shear strength exceeding 2000psi and a T-peel strength of 25pli. This flexible epoxy has an elongation of 180% and superior electrical insulation properties with a volume resistivity of 1×1014 ohm-cm. It bonds to a variety of substrates including metals, glass, ceramics, rubbers and many plastics and is widely used in the optical, electrical, electronic, computer and OEM industries.