Flexible epoxy cures from Master Bond

24 August 2011

For demanding applications where flexible, impact resistant bonds are required, Master Bond has developed Polymer System EP37-3FLF. This optically clear, two component epoxy has resistance to cryogenic temperatures and severe thermal cycling. The company says its low exotherm also makes it a superb potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. Its unique combination of properties allows it to cure without stressing delicate electronic components.

Serviceable over a range of 4K to 250°F, EP37-3FLF cures at room temperature in two to three days or faster at elevated temperatures. This epoxy offers a convenient, non-critical 1:1 mix ratio by weight or volume, and a low mixed viscosity of 1,400 to 1,500 cps. Additionally, users can work with a 100g mass of the adhesive at room temperature for up to 90min.

EP37-3FLF has a bond shear strength exceeding 2000psi and a T-peel strength of 25pli. This flexible epoxy has an elongation of 180% and superior electrical insulation properties with a volume resistivity of 1×1014 ohm-cm. It bonds to a variety of substrates including metals, glass, ceramics, rubbers and many plastics and is widely used in the optical, electrical, electronic, computer and OEM industries.


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